Technical Capabilities

The following is a brief capabilities list:

  • Materials and process per military and IPC spec. UL approved.
  • Double Sided & Multi-layers up to 14 layers. Mat’l thickness > .002 – .200″
  • Minimum line and spacing .005″. Min hole size .008″
  • Max active board size 16 x 22″. Max copper thickness 10 oz.
  • Mat’l: FR-4, FR-5, Polyamide, Teflon, Rogers, Taconic, Arlon…
  • SMOBC. LPI or Dry Film Soldermask green, blue, red, black…
  • Silkscreen: white, black, yellow.
  • ENIG, ENEPIG, IMMERSION SILVER, HASL/HASL LF, TIN PLATE AND HARD GOLD TABS.
  • BLIND AND BURIED VIAS.
  • COPPER THICKNESS FROM 1/2 TO 10 OZ.
  • PCB DESIGN/LAYOUT

 

PCB design and assembly capabilities are also available. Specialize in the exotic substrates for microwave/RF industry. Galaxy Electronics can be a reliable niche supplier for you. Small business environment, attention to detail & customer service.

 

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